Reliability and failure
1
Understanding surface defect mechanism of ultra-low carbon steel using multiscale simulation
Ultra low carbon steel shows inhomogeneous plastic deformation. Developing dislocation density based on crystal plasticity finite element method model, surface defects are numerically analyzed.
2
Structure-thermal analysis framework for LED unit
In LED unit, voids are formed in solder during solder reflow process. Effects of voids on thermal conductance and shear strength in solder is analyzed.
3
Package-level hybrid bonding interaction modeling for reliability engineering
Using hybrid bonding finite element model based on interaction mechanisms of Cu and dielectric, in-process reliability is analyzed with optimized process parameters.